Brian Kaiser
7Patents
5h-index
9Co-inventors
56Inventor score
Filing activity: Jun 7, 1991 → Mar 5, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6605551B2 | Electrocoating process to form a dielectric layer in an organic substrate to reduce loop inductance | Electricity | 44 | Expired |
| US5139971A | Anneal to decrease moisture absorbance of intermetal dielectrics | Emerging Cross-Sectional Technologies | 43 | Expired |
| US6829133B2 | Capacitor | Electricity | 21 | Expired |
| US6248951A | Dielectric decal for a substrate of an integrated circuit package | Electricity | 11 | Expired |
| US7348496B2 | Circuit board with organic dielectric layer | Electricity | 5 | Expired |
| US6278185A | Semi-additive process (SAP) architecture for organic leadless grid array packages | Electricity | 5 | Expired |
| US10960425B2 | Mechanism for delivering highly viscous materials for coating an interior surface of a tubular substrate | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.