Resistivity control of CIC material
US6248958A · kind A · utility
12Cited by
13References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 1998 |
| Grant date | Jun 19, 2001 |
| Priority date | — |
| Expiry date | Nov 30, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board having a diffusion barrier layer between layers of copper-invar-copper material to prevent the migration of nickel, originating from the invar, into the surrounding copper layers is disclosed. A printed circuit board having a diffusion barrier layer between a conductive core and a conductive layer, and a method of forming the printed circuit board are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.