Patent · US Expired

Scanning device

US6250141A · kind A · utility

4Cited by

2References

11Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Stefan Geyer · Dresden, DE
Michael Horn · South Setauket, US
Rudiger Hunger · Dresden, DE

Key dates

Filing date	Nov 9, 1999
Grant date	Jun 26, 2001
Priority date	—
Expiry date	Nov 9, 2019

Classification

Technology area (CPC H)Electricity
CPC primaryH01L22/12
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A scanning device for semiconductor wafers with which rapid and dependable scanning is permitted. The invention is characterized by a base plate with a guiding pin protruding from it for the manual guidance of a depositing plate which is displaceable on the latter. The depositing plate is intended to receive a semiconductor wafer and is provided on an underside with meandering guiding channels for guiding by the guiding pin. A liquid drop is kept on a surface of the semiconductor wafer by a scanning tube and collects metal and dopant traces from the semiconductor wafer. The liquid drop can then be analyzed for determining a purity of the surface of the semiconductor wafer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.