Substrate holder, method for polishing substrate, and method for fabricating semiconductor device
US6251000A · kind A · utility
2Cited by
6References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 1999 |
| Grant date | Jun 26, 2001 |
| Priority date | — |
| Expiry date | Sep 20, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A substrate holder for holding a substrate to be polished thereon and pressing the substrate against a polishing pad includes a substrate-holding head for holding the substrate thereon and pressing the substrate against the polishing pad. The substrate-holding head is disposed to be vertically movable toward/away from the polishing pad. A pressing member for pressing a peripheral region of the substrate, except for an outer edge region thereof, against the polishing pad is attached to the substrate-holding head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.