Apparatus and method for plasma processing
US6251216A · kind A · utility
52Cited by
1References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 1998 |
| Grant date | Jun 26, 2001 |
| Priority date | — |
| Expiry date | Dec 16, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S156/916
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A plasma processing apparatus includes a reaction chamber in which plasma is generated from a reactive gas introduced thereto and a film on a substrate is processed with the plasma generated. The main members of the reaction chamber are covered with protective members made of synthetic quartz.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.