Apparatus and method for polishing a semiconductor wafer in an overhanging position
US6251785A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 10, 1999 |
| Grant date | Jun 26, 2001 |
| Priority date | — |
| Expiry date | Jun 10, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B41/061
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus and method for preventing gimballing in the polishing of a semiconductor wafer held in an overhanging position with respect to a polishing pad. One embodiment includes a support apparatus for use with a device for polishing a semiconductor wafer, the device having a rotatable wafer carrier and a polishing pad attached to a rotatable platen, the wafer carrier being movable to place a semiconductor wafer held by the wafer carrier in a contacting and overhanging relationship with the polishing pad. The support apparatus includes a support to prevent gimballing of the wafer carrier when the wafer held by the wafer carrier is in the overhanging and contacting relationship with the polishing pad, the support having a low polishing surface to contact and support the semiconductor wafer. Another embodiment includes a supporting pad for use with a polishing pad, the supporting pad including a ring having an inner diameter greater than the outer diameter of the polishing pad, the ring having a supporting surface of a material with low polishing characteristics. A method for assembling polishing pads to a circular platen and a process for polishing a semiconductor wafer are also …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.