System and method for curing a resin disposed between a top and bottom substrate with thermal management
US6254809A · kind A · utility
5Cited by
29References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 19, 1998 |
| Grant date | Jul 3, 2001 |
| Priority date | — |
| Expiry date | May 19, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S425/81
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A system and method cure a combination of a top and a bottom substrate with a resin disposed in-between. A cure platform includes a chuck on which the combination rests. A cure device cures the resin. An actuation assembly separates the chuck from the platform to thermally isolate the chuck during a curing operation performed by the cure device. A post cooling assembly may be provided to cool the chuck and the combination after a curing operation is performed by the cure device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.