Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same
US6254972A · kind A · utility
14Cited by
20References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 1999 |
| Grant date | Jul 3, 2001 |
| Priority date | — |
| Expiry date | Jun 29, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31544
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor device having a thermoset-containing, dielectric material and methods for fabricating the same is provided. The device may take the form of a printed circuit board, an integrated circuit chip carrier, or the like. The dielectric material is a non-fibrillated, fluoropolymer matrix that has inorganic particles distributed therein and is impregnated with a thermoset material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.