Mark D. Poliks
49Patents
17h-index
52Co-inventors
84Inventor score
Filing activity: Sep 16, 1991 → Aug 7, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6929900B2 | Tamper-responding encapsulated enclosure having flexible protective mesh structure | Electricity | 118 | Expired |
| US5194930A | Dielectric composition and solder interconnection structure for its use | Electricity | 103 | Expired |
| US7301108B2 | Multi-layered interconnect structure using liquid crystalline polymer dielectric | Emerging Cross-Sectional Technologies | 95 | Expired |
| US6686539B2 | Tamper-responding encapsulated enclosure having flexible protective mesh structure | Electricity | 89 | Expired |
| US6465084B1 | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements | Emerging Cross-Sectional Technologies | 79 | Expired |
| US6329603A | Low CTE power and ground planes | Emerging Cross-Sectional Technologies | 73 | Expired |
| US6600224B1 | Thin film attachment to laminate using a dendritic interconnection | Electricity | 60 | Expired |
| US6351030B2 | Electronic package utilizing protective coating | Electricity | 50 | Expired |
| US9606245B1 | Autonomous gamma, X-ray, and particle detector | Physics | 42 | Active |
| US6613413B1 | Porous power and ground planes for reduced PCB delamination and better reliability | Emerging Cross-Sectional Technologies | 42 | Expired |
| US6452117B2 | Method for filling high aspect ratio via holes in electronic substrates and the resulting holes | Emerging Cross-Sectional Technologies | 41 | Expired |
| US5888850A | Method for providing a protective coating and electronic package utilizing same | Electricity | 39 | Expired |
| US6207595A | Laminate and method of manufacture thereof | Emerging Cross-Sectional Technologies | 30 | Expired |
| US7025607B1 | Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate | Electricity | 27 | Expired |
| US6722031B2 | Method for making printed circuit board having low coefficient of thermal expansion power/ground plane | Emerging Cross-Sectional Technologies | 24 | Expired |
| US6826830B2 | Multi-layered interconnect structure using liquid crystalline polymer dielectric | Emerging Cross-Sectional Technologies | 22 | Expired |
| US6581280B2 | Method for filling high aspect ratio via holes in electronic substrates | Emerging Cross-Sectional Technologies | 20 | Expired |
| US7541058B2 | Method of making circuitized substrate with internal optical pathway | Physics | 14 | Active |
| US6254972A | Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same | Emerging Cross-Sectional Technologies | 14 | Expired |
| US8288857B2 | Anti-tamper microchip package based on thermal nanofluids or fluids | Electricity | 13 | Active |
| US6645607B2 | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements | Emerging Cross-Sectional Technologies | 13 | Expired |
| US6944946B2 | Porous power and ground planes for reduced PCB delamination and better reliability | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6534179B2 | Halogen free triazines, bismaleimide/epoxy polymers, prepregs made therefrom for circuit boards and resin coated articles, and use | Emerging Cross-Sectional Technologies | 9 | Expired |
| US7713767B2 | Method of making circuitized substrate with internal optical pathway using photolithography | Electricity | 9 | Active |
| US5756405A | Technique for forming resin-impregnated fiberglass sheets | Emerging Cross-Sectional Technologies | 9 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.