Lithographic contact elements
US6255126A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 2, 1998 |
| Grant date | Jul 3, 2001 |
| Priority date | — |
| Expiry date | Dec 2, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49224
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of forming an interconnection, including a spring contact element, by lithographic techniques. In one embodiment, the method includes applying a masking material over a first portion of a substrate, the masking material having an opening which will define a first portion of a spring structure, depositing a structure material (e.g., conductive material) in the opening, and overfilling the opening with the structure material, removing a portion of the structure material, and removing a first portion of the masking material. In this embodiment, at least a portion of the first portion of the spring structure is freed of masking material. In one aspect of the invention, the method includes planarizing the masking material layer and structure material to remove a portion of the structure material. In another aspect, the spring structure formed includes one of a post portion, a beam portion, and a tip structure portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.