Gaetan L. Mathieu
175Patents
74h-index
63Co-inventors
93Inventor score
Filing activity: Sep 8, 1988 → Sep 6, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5772451A | Sockets for electronic components and methods of connecting to electronic components | Emerging Cross-Sectional Technologies | 453 | Expired |
| US5974662A | Method of planarizing tips of probe elements of a probe card assembly | Emerging Cross-Sectional Technologies | 396 | Expired |
| US5917707A | Flexible contact structure with an electrically conductive shell | Emerging Cross-Sectional Technologies | 340 | Expired |
| US5994152A | Fabricating interconnects and tips using sacrificial substrates | Electricity | 322 | Expired |
| US6336269B1 | Method of fabricating an interconnection element | Emerging Cross-Sectional Technologies | 312 | Expired |
| US5806181A | Contact carriers (tiles) for populating larger substrates with spring contacts | Emerging Cross-Sectional Technologies | 304 | Expired |
| US6255126A | Lithographic contact elements | Emerging Cross-Sectional Technologies | 265 | Expired |
| US5829128A | Method of mounting resilient contact structures to semiconductor devices | Emerging Cross-Sectional Technologies | 254 | Expired |
| US6029344A | Composite interconnection element for microelectronic components, and method of making same | Emerging Cross-Sectional Technologies | 228 | Expired |
| US6184053A | Method of making microelectronic spring contact elements | Electricity | 225 | Expired |
| US5832601A | Method of making temporary connections between electronic components | Emerging Cross-Sectional Technologies | 209 | Expired |
| US6110823A | Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method | Emerging Cross-Sectional Technologies | 199 | Expired |
| US6778406B2 | Resilient contact structures for interconnecting electronic devices | Emerging Cross-Sectional Technologies | 194 | Expired |
| US6043563A | Electronic components with terminals and spring contact elements extending from areas which are remote from the terminals | Electricity | 191 | Expired |
| US5864946A | Method of making contact tip structures | Emerging Cross-Sectional Technologies | 184 | Expired |
| US6482013B2 | Microelectronic spring contact element and electronic component having a plurality of spring contact elements | Emerging Cross-Sectional Technologies | 182 | Expired |
| US6520778B1 | Microelectronic contact structures, and methods of making same | Electricity | 182 | Expired |
| US5926951A | Method of stacking electronic components | Emerging Cross-Sectional Technologies | 180 | Expired |
| US6509751B1 | Planarizer for a semiconductor contactor | Physics | 175 | Expired |
| US6054756A | Connection components with frangible leads and bus | Electricity | 173 | Expired |
| US6032356A | Wafer-level test and burn-in, and semiconductor process | Emerging Cross-Sectional Technologies | 171 | Expired |
| US6050829A | Making discrete power connections to a space transformer of a probe card assembly | Physics | 169 | Expired |
| US7225538B2 | Resilient contact structures formed and then attached to a substrate | Emerging Cross-Sectional Technologies | 169 | Expired |
| US6441315B1 | Contact structures with blades having a wiping motion | Emerging Cross-Sectional Technologies | 162 | Expired |
| US6268015A | Method of making and using lithographic contact springs | Emerging Cross-Sectional Technologies | 151 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.