Semiconductor device with a protective sheet to affix a semiconductor chip
US6255741A · kind A · utility
94Cited by
14References
36Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 16, 1999 |
| Grant date | Jul 3, 2001 |
| Priority date | — |
| Expiry date | Mar 16, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat resisting resin sheet is bonded to a semiconductor chip as a protective cap for protecting a beam structure provided on the semiconductor chip, through a heat resisting adhesive. The heat resisting resin sheet is composed of a polyimide base member and the heat resisting adhesive is composed of silicone adhesive. The heat resisting resin sheet is not deformed during a manufacturing process of the semiconductor chip. In addition, grinding water does not invade into the semiconductor chip during dicing-cut.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.