Flexible wafer level probe
US6255832A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 3, 1999 |
| Grant date | Jul 3, 2001 |
| Priority date | — |
| Expiry date | Dec 3, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07357
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A test probe head has a plurality of electrically conducting wire members held in place in a frame by movable plates. The wire members are threaded through apertures in the plates and the plates are moved relative to each other to bend the wires to thereby hold the wires in position in the frame. The wires are used to make physical contact with both a support substrate for the test probe head and an integrated circuit under test. The physical contact of the wires with both the substrate and the integrated circuit provides electrical connections between the pads in the support substrate and those on the integrated circuit to perform the testing of the integrated circuit. With this arrangement, there is no bonding of the wires to the pads of the support substrate. The elimination of the bonding to the pads of the support substrate eliminates a major cause of probe head failures. Further since the movable wafers hold the wires in operating position, there is no need of embedding the wires in a potting compound permitting removal and replacement of individual wires by manipulation of the movable wafers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.