Electrostatic chucks
US6256186A · kind A · utility
2Cited by
8References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 10, 1998 |
| Grant date | Jul 3, 2001 |
| Priority date | — |
| Expiry date | Sep 10, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/23
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrostatic chuck 12 for a plasma reactor apparatus 10 comprises a base metallic section 23, a pair of electrodes 24 set in bonding material 27 and electrically insulated from the base by a plate 29 and a thick dielectric layer 20 (e.g. 0.5 to 1.5 mm), which covers the electrodes 24 and bonding material 27 and forms the support surfaces for wafers 31.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.