Patent · US Expired

Method for transforming a substrate with edge contacts into a ball grid array

US6256877A · kind A · utility

7Cited by

3References

5Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Hans-Juergen Hacke · Munich, DE
Manfred Wossler · Munich, DE
Karl Weidner · Birkenfeld, DE
Wolfgang Radlik · Munich, DE

Key dates

Filing date	Dec 10, 1998
Grant date	Jul 10, 2001
Priority date	—
Expiry date	Dec 10, 2018

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49144
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The transformation of An IC substrate with edge contacts into a ball grid array is accomplished using a flexible circuit that has terminals arranged planarly on the underside for receiving meltable solder humps and whose conductors leading outwardly from the terminals have exposed ends. The upper side of the flexible circuit is connected with the lower side of the substrate, whereupon the edge regions of the flexible circuit are bent up and around the substrate and the ends of the conductors are electrically contacted to the edge contacts of the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.