Light emitting diode with a permanent subtrate of transparent glass or quartz and the method for manufacturing the same
US6258699A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 10, 1999 |
| Grant date | Jul 10, 2001 |
| Priority date | — |
| Expiry date | May 10, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/135
Abstract
A method of manufacturing a light emitting diode (LED) includes growing a light emitting region on a temporary substrate, bonding a transparent substrate of glass or quartz to the light emitting region and then removing the temporary substrate. A metal bonding agent also serving as an ohmic contact layer with LED is used to bond the transparent substrate to form a dual substrate LED element which is then heated in a wafer holding device that includes a graphite lower chamber and a graphite upper cover with a stainless steel screw. Because of the different thermal expansion coefficients between stainless and graphite, the stainless steel screw applies a pressure to the dual substrate LED element during the heating process to assist the bonding of the transparent substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.