Plasma processing apparatus with coils in dielectric windows
US6259209A · kind A · utility
25Cited by
14References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 26, 1997 |
| Grant date | Jul 10, 2001 |
| Priority date | — |
| Expiry date | Sep 26, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05H1/46
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A wafer processing chamber 11 includes a wafer support 12, a dielectyric window 13 and coaxial coils 15 and 16 located outside the dielectric window 13 for inducing a plasma within the chamber. A variety of coil/dielectric windows are described together with protocols for their control.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.