Methods for making z-axis electrical connections
US6260264A · kind A · utility
156Cited by
5References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 8, 1997 |
| Grant date | Jul 17, 2001 |
| Priority date | — |
| Expiry date | Dec 8, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a method for connecting an integrated circuit chip to a circuit substrate. The method includes the step of the steps pre-applying adhesive directly to a bumped side of integrated circuit chip. The method also includes the step of pressing the bumped side of the integrated circuit chip, which has previously been coated with adhesive, against the circuit substrate such that the bumps provide an electrical connection between the integrated circuit chip and the circuit substrate. The pre-applied adhesive on the chip forms a bond between the integrated circuit chip and the circuit substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.