Heat dissipation module
US6260611A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 13, 1999 |
| Grant date | Jul 17, 2001 |
| Priority date | — |
| Expiry date | Dec 13, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A high watt number heat dissipation module having externally exposed fins is disclosed. The high heat produced by semiconductor operation is dissipated employing the present module, and the packaging rubber body is prevented from overflow. The present module is mounted above the semiconductor wafer and the interior of the heat dissipation plate absorbs the high heat from the wafer, and heat energy is dissipated by means of the fins at the top portion of the heat dissipation plate. A plurality layers of skirts are provided at the surrounding of the heat dissipation plate and the number of layers o the skirts is dependent on the watt number of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.