Method and apparatus for metal oxide chemical vapor deposition on a substrate surface
US6261373A · kind A · utility
4Cited by
13References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 14, 1999 |
| Grant date | Jul 17, 2001 |
| Priority date | — |
| Expiry date | Jul 14, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/4415
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and apparatus for improved metal oxide chemical vapor deposition on a substrate surface where the application boundary layer is reduced and where the uniformity of the application boundary layer is greatly enhanced in a reactor. Primary and secondary sonic or other disturbance sources are introduced to the interior chamber or an oscillating chuck is incorporated to influence the boundary layer thickness and uniformity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.