Composition for circuit board manufacture
US6261466A · kind A · utility
13Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 24, 1998 |
| Grant date | Jul 17, 2001 |
| Priority date | — |
| Expiry date | Nov 24, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/124
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process and composition for treating a metal surface to increase its surface roughness for subsequent adhesion to a polymer layer. The composition comprises hydrogen peroxide, inorganic acid, an amine free of a surfactant group and optionally, a corrosion inhibitor. The composition is characterized by elimination of a surfactant from solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.