Peter Benson
56Patents
14h-index
20Co-inventors
80Inventor score
Filing activity: Jun 30, 1998 → May 18, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7091124B2 | Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices | Electricity | 89 | Expired |
| US6279012A | Reducing the memory footprint of a session duration semispace | Emerging Cross-Sectional Technologies | 69 | Expired |
| US7157310B2 | Methods for packaging microfeature devices and microfeature devices formed by such methods | Emerging Cross-Sectional Technologies | 50 | Expired |
| US7759800B2 | Microelectronics devices, having vias, and packaged microelectronic devices having vias | Electricity | 44 | Expired |
| US6931423B2 | Write-barrier maintenance in a garbage collector | Emerging Cross-Sectional Technologies | 27 | Expired |
| US6604182B1 | Methods for managing memory in a run-time environment including activation and deactivation of objects | Emerging Cross-Sectional Technologies | 24 | Expired |
| US7199439B2 | Microelectronic imagers and methods of packaging microelectronic imagers | Electricity | 20 | Expired |
| US6421689B1 | Moderately conservative, mostly copying 2 space garbage collector in the nursery of a generational memory manager | Emerging Cross-Sectional Technologies | 18 | Expired |
| US7072919B2 | Method for performing data migration | Emerging Cross-Sectional Technologies | 18 | Expired |
| US7115961B2 | Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices | Electricity | 17 | Expired |
| US7235431B2 | Methods for packaging a plurality of semiconductor dice using a flowable dielectric material | Electricity | 15 | Expired |
| US7521296B2 | Methods of fabricating a microlens including selectively curing flowable, uncured optically trasmissive material | Electricity | 15 | Active |
| US6457019B1 | Memory management within a run-time environment | Emerging Cross-Sectional Technologies | 15 | Expired |
| US6829761B1 | Method and apparatus for managing shared memory in a run-time environment | Physics | 14 | Expired |
| US6261466A | Composition for circuit board manufacture | Electricity | 13 | Expired |
| US7629250B2 | Method for creating electrically conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies | Electricity | 12 | Active |
| US6711657B1 | Methods for managing memory in a run-time environment including registration of a deallocation routine at explicit, lazy initialization | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6782532B1 | Object type system for a run-time environment using generated high-order language instructions for generic functions | Physics | 11 | Expired |
| US7080382B2 | Accessing shorter-duration instances of activatable objects based on object references stored in longer-duration memory | Physics | 10 | Expired |
| US7413979B2 | Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices | Electricity | 10 | Active |
| US6760825B1 | Memory management using migration for a run-time environment | Physics | 9 | Expired |
| US7435620B2 | Low temperature methods of forming back side redistribution layers in association with through wafer interconnects | Electricity | 9 | Active |
| US7189954B2 | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers | Electricity | 8 | Expired |
| US7249235B2 | Architecture for a scalable and user-extensible heap dump analysis tool | Emerging Cross-Sectional Technologies | 7 | Expired |
| US7419852B2 | Low temperature methods of forming back side redistribution layers in association with through wafer interconnects, semiconductor devices including same, and assemblies | Electricity | 7 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.