Lead frame with heat slug
US6262475A · kind A · utility
7Cited by
4References
18Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Feb 16, 1999 |
| Grant date | Jul 17, 2001 |
| Priority date | — |
| Expiry date | Feb 16, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The addition of a heat slug to a lead frame establishes a heat conduction path from a silicon chip on the lead frame to the heat slug. Hence, when a semiconductor package that encloses the lead frame and the silicon chip is formed, heat produced by the silicon chip can still be channeled away through the radiating surface of the heat slug. Furthermore, the heat slug can be bent over to cover burrs outside the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.