Ultrasonic methods and apparatus for the in-situ detection of workpiece loss
US6264532A · kind A · utility
21Cited by
6References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 28, 2000 |
| Grant date | Jul 24, 2001 |
| Priority date | — |
| Expiry date | Mar 28, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for use with a chemical mechanical planarization (CMP) system includes an ultrasonic source that is disposed proximate a workpiece carrier. The ultrasonic source generates an ultrasonic signal toward an area of a polishing pad or a workpiece during the polishing of the workpiece held by the carrier. An ultrasonic detector is configured to receive a reflected ultrasonic signal for processing in order to determine the presence of extraneous material at the area of the polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.