Reinforced sealing technique for an integrated circuit package
US6264778A · kind A · utility
0Cited by
11References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 29, 1994 |
| Grant date | Jul 24, 2001 |
| Priority date | — |
| Expiry date | Jul 29, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
One or more reinforcement pins are inserted between the lid and base of a sealed integrated-circuit package. The reinforcement pins reinforce a sealing layer between the lid and the base, particularly against shear forces exerted on the sealing layer between the lid and the base of a package. Shorter pins are provided which do not extend through the lid or base. Longer pins are provided which extend through the lid or base, with the ends of the pins being mechanically secured to the lid or base and sealed with solder, glass, or epoxy material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.