Leonard L. Mora
10Patents
5h-index
10Co-inventors
59Inventor score
Filing activity: Jul 23, 1993 → Feb 21, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5491362A | Package structure having accessible chip | Emerging Cross-Sectional Technologies | 41 | Expired |
| US5687474A | Method of assembling and cooling a package structure with accessible chip | Emerging Cross-Sectional Technologies | 15 | Expired |
| US6891260B1 | Integrated circuit package substrate with high density routing mechanism | Electricity | 10 | Expired |
| US5539151A | Reinforced sealing technique for an integrated-circuit package | Electricity | 9 | Expired |
| US6777802B1 | Integrated circuit package substrate with multiple voltage supplies | Electricity | 6 | Expired |
| US6479319B1 | Contact escape pattern | Electricity | 5 | Expired |
| US7750460B2 | Ball grid array package layout supporting many voltage splits and flexible split locations | Electricity | 1 | Active |
| US7804167B2 | Wire bond integrated circuit package for high speed I/O | Electricity | 1 | Active |
| US6748576B2 | Active trace rerouting | Electricity | 0 | Expired |
| US6264778A | Reinforced sealing technique for an integrated circuit package | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.