Method for making an integrated circuit capacitor including tantalum pentoxide
US6265260A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 1999 |
| Grant date | Jul 24, 2001 |
| Priority date | — |
| Expiry date | Jun 30, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02205
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for making an integrated circuit capacitor which in one embodiment preferably comprises the steps of: forming, adjacent a semiconductor substrate, a first metal electrode comprising a metal nitride surface portion; forming a tantalum pentoxide layer on the metal nitride surface portion while maintaining a temperature below an oxidizing temperature of the metal; remote plasma annealing the tantalum pentoxide layer; and forming a second electrode adjacent the tantalum pentoxide layer. The step of forming the tantalum pentoxide layer preferably comprises chemical vapor deposition of the tantalum pentoxide at a temperature below about 500.degree. C. Accordingly, oxidation of the metal is avoided and a high quality tantalum pentoxide is produced. The metal of the first metal electrode may comprise at least one of titanium, tungsten, tantalum, and alloys thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.