Cleaning agent for use in producing semiconductor devices and process for producing semiconductor devices using the same
US6265309A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | May 10, 1999 |
| Grant date | Jul 24, 2001 |
| Priority date | — |
| Expiry date | May 10, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/906
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A cleaning agent for use in producing semiconductor devices. The cleaning agent is an aqueous solution containing (A) a fluorine-containing compound, (B) a salt of boric acid, (C) a water-soluble organic solvent, and optionally, (D) a specific quaternary ammonium salt or (D') a specific ammonium salt of an organic carboxylic acid or a specific amine salt of an organic carboxylic acid. The polymeric deposit inside and around the via holes and on the side wall of the conductive line pattern formed during the dry etching process can be effectively removed by using the cleaning agent without affecting the dimensions of the via holes and the conductive line pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.