Wafer edge engineering method and device
US6265328A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 28, 1999 |
| Grant date | Jul 24, 2001 |
| Priority date | — |
| Expiry date | Jan 28, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6715
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides an apparatus (400) (500) for abating edge material from a substrate, e.g., SOI. The apparatus includes, among other elements, a housing and a rotatable member (401) coupled to the housing. The rotatable member is a susceptor, which is relatively flat for securing a substrate. A movable dispensing head (421) is coupled to the housing and is overlying the rotatable member. The movable dispensing head (421) is operable to emit a stream of directed fluid to one or more locations of the susceptor. The apparatus also includes a fluid source, which is coupled to the movable dispensing head. The fluid source provides fluid to ablate material from the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.