Lead frame and semiconductor device using the lead frame and method of manufacturing the same
US6265762A · kind A · utility
20Cited by
10References
18Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Mar 18, 1997 |
| Grant date | Jul 24, 2001 |
| Priority date | — |
| Expiry date | Mar 18, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/20752
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided a semiconductor chip mounting area for mounting a semiconductor chip, and the points of the inner leads are made to come closer to the semiconductor chip mounting area by arranging the points of the inner leads at equal intervals over the whole periphery of the semiconductor chip mounting area. The points of the inner leads are arranged along the whole periphery of the semiconductor chip mounting area, and the lead pitch at the points of the inner leads corresponding to a corner portion of the semiconductor chip mounting area is made wider than the lead pitch of the other inner lead points.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.