Hitachi Hokkai Semiconductor Ltd.
59Patents
6Active
59Granted
36Portfolio score
Filing activity: Mar 13, 1992 → Sep 22, 2011 · 5 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6208525A | Process for mounting electronic device and semiconductor device | Emerging Cross-Sectional Technologies | 171 | Expired |
| US5219794A | Semiconductor integrated circuit device and method of fabricating same | Emerging Cross-Sectional Technologies | 124 | Expired |
| US6713849B2 | Semiconductor utilizing grooves in lead and tab portions of lead frame to prevent peel off between the lead frame and the resin | Emerging Cross-Sectional Technologies | 92 | Expired |
| US5910010A | Semiconductor integrated circuit device, and process and apparatus for manufacturing the same | Electricity | 81 | Expired |
| US6232650A | Semiconductor device having a chip mounted on a flexible substrate with separated insulation layers to prevent short-circuiting | Electricity | 59 | Expired |
| US6649448B2 | Method of manufacturing a semiconductor device having flexible wiring substrate | Electricity | 51 | Expired |
| US6780677B2 | Process for mounting electronic device and semiconductor device | Emerging Cross-Sectional Technologies | 26 | Expired |
| US5684315A | Semiconductor memory device including memory cells each having an information storage capacitor component formed over control electrode of cell selecting transistor | Electricity | 20 | Expired |
| US6265762A | Lead frame and semiconductor device using the lead frame and method of manufacturing the same | Electricity | 20 | Expired |
| US6551862B2 | Semiconductor device and method of manufacturing the same | Electricity | 18 | Expired |
| US6461896B1 | Process for mounting electronic device and semiconductor device | Emerging Cross-Sectional Technologies | 17 | Expired |
| US5440521A | Semiconductor integrated circuit device | Physics | 15 | Expired |
| US6767767B2 | Method of manufacturing a semiconductor device in which a block molding package utilizes air vents in a substrate | Emerging Cross-Sectional Technologies | 12 | Expired |
| US7518156B2 | Semiconductor device | Emerging Cross-Sectional Technologies | 12 | Active |
| US6820179B2 | Semiconductor device and data processing system | Physics | 10 | Expired |
| US6764878B2 | Method of manufacturing a resin encapsulated semiconductor device to provide a vent hole in a base substrate | Electricity | 10 | Expired |
| US6472749B1 | Semiconductor device having a shortened wiring length to reduce the size of a chip | Electricity | 9 | Expired |
| US7911054B2 | Semiconductor device | Emerging Cross-Sectional Technologies | 8 | Active |
| US6787442B2 | Method of making a semiconductor having multi-layered electrodes including nickel and phosphorus and solder formed with tin and an alkaline earth metal | Electricity | 8 | Expired |
| US6835596B2 | Method of manufacturing a semiconductor device | Electricity | 7 | Expired |
| US6577263B2 | Analog switch circuit | Electricity | 7 | Expired |
| US6396142B1 | Semiconductor device | Electricity | 7 | Expired |
| US6737741B2 | Process for mounting electronic device and semiconductor device | Emerging Cross-Sectional Technologies | 6 | Expired |
| US6781234B2 | Semiconductor device having electrodes containing at least copper nickel phosphorous and tin | Electricity | 6 | Expired |
| US6553660B2 | Electronic device and a method of manufacturing the same | Emerging Cross-Sectional Technologies | 6 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.