Flip chip with integrated flux and underfill
US6265776A · kind A · utility
34Cited by
5References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 27, 1998 |
| Grant date | Jul 24, 2001 |
| Priority date | — |
| Expiry date | Apr 27, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flip chip having solder bumps, an integrated underfill, and a separate flux coating, as well as methods for making such a device, is described. The resulting device is well suited for a simple one-step application to a printed circuit board, thereby simplifying flip chip manufacturing processes which heretofore have required a separate underfilling step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.