CSP type semiconductor device with reduced package size
US6268652A · kind A · utility
8Cited by
18References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 31, 1998 |
| Grant date | Jul 31, 2001 |
| Priority date | — |
| Expiry date | Aug 31, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a CSP type semiconductor device and a manufacturing method thereof, each pad on a semiconductor chip is connected to an end part of a lead through wire bonding which is mechanicalLy bent to form a bending part, each end part is shifted toward the semiconductor chip, and a mold resin is applied on the above constituents.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.