Semiconductor body with layer of solder material comprising chromium

US6268659A · kind A · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Holger Huebner · Neustadt an der Aisch, DE
• Manfred Schneegans · Vaterstetten, DE

Key dates

• Filing date: Sep 25, 1997
• Grant date: Jul 31, 2001
• Expiry date: Sep 25, 2017

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/10253
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A semiconductor body with a layer of solder material and a method for soldering the semiconductor body include a chromium layer applied to a rear side of the semiconductor body, and a tin layer applied to the chromium layer. The semiconductor is subsequently soldered directly to the metal substrate, that is without further additives, by being heated to temperatures above 250.degree. C. This metal layer system for soldering power semiconductors to cooling bodies enables two metal layers to be dispensed with as compared with known four metal layer systems.