Process for manufacturing electronic circuits
US6269998A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 3, 2000 |
| Grant date | Aug 7, 2001 |
| Priority date | — |
| Expiry date | Nov 3, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49174
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.