Simplified process for production of roughened copper foil
US6270645A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 26, 1997 |
| Grant date | Aug 7, 2001 |
| Priority date | — |
| Expiry date | Sep 26, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0723
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A simplified process and apparatus for electrodepositing a bond-enhancing copper treatment layer on a surface of copper foil, preferably wherein a single treatment layer is uniformly applied on raw copper foil using a current density of from about 40 to about 100 A/ft.sup.2, a plating time of greater than 30 seconds, and the electrolyte is a copper sulfate-sulfuric acid solution containing arsenic, chloride ions and 2 imidazalidinethione. The raw foil is transferred to a station for applying the treatment directly from a rotating drum cathode machine on which it is produced, at the same speed at which the raw foil is produced, and then to a barrier layer station, a stainproofing station and a chemical adhesion promoter station, after which it is dried and coiled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.