Charles B. Yates
10Patents
4h-index
7Co-inventors
53Inventor score
Filing activity: Dec 3, 1973 → Apr 11, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US3998601A | Thin foil | Emerging Cross-Sectional Technologies | 53 | Expired |
| US5863410A | Process for the manufacture of high quality very low profile copper foil and copper foil produced thereby | Electricity | 34 | Expired |
| US5989727A | Electrolytic copper foil having a modified shiny side | Emerging Cross-Sectional Technologies | 9 | Expired |
| US6372113B2 | Copper foil and copper clad laminates for fabrication of multi-layer printed circuit boards and process for producing same | Emerging Cross-Sectional Technologies | 8 | Expired |
| US6224991A | Process for electrodeposition of barrier layer over copper foil bonding treatment, products thereof and electrolyte useful in such process | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6270648A | Process and apparatus for the manufacture of high peel-strength copper foil useful in the manufacture of printed circuit boards, and laminates made with such foil | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6270645A | Simplified process for production of roughened copper foil | Electricity | 2 | Expired |
| US6342308B1 | Copper foil bonding treatment with improved bond strength and resistance to undercutting | Emerging Cross-Sectional Technologies | 2 | Expired |
| US6291080A | Thin copper foil, and process and apparatus for the manufacture thereof | Emerging Cross-Sectional Technologies | 1 | Expired |
| USRE30180E | Plural copper-layer treatment of copper foil and article made thereby | General | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.