Process and apparatus for the manufacture of high peel-strength copper foil useful in the manufacture of printed circuit boards, and laminates made with such foil
US6270648A · kind A · utility
3Cited by
11References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 22, 1999 |
| Grant date | Aug 7, 2001 |
| Priority date | — |
| Expiry date | Oct 22, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31504
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A one-step, integrated process and apparatus for producing electrolytic copper foil having a dual-layer copper bond-enhancing treatment electrodeposited on the matte side of the foil, which employs two "super anodes" on a rotating drum cathode to deposit the treatment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.