Porous materials
US6271273A · kind A · utility
123Cited by
6References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2000 |
| Grant date | Aug 7, 2001 |
| Priority date | — |
| Expiry date | Oct 10, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02282
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Porous organo polysilica dielectric materials having low dielectric constants useful in electronic component manufacture are disclosed along with methods of preparing the porous organo polysilica dielectric materials. Also disclosed are methods of forming integrated circuits containing such porous organo polysilica dielectric materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.