Heat management in wafer processing equipment using thermoelectric device
US6271459A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 26, 2000 |
| Grant date | Aug 7, 2001 |
| Priority date | — |
| Expiry date | Apr 26, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N10/00
Abstract
A semiconductor processing system and method, which uses heat energy typically wasted in most common semiconductor processing systems, to generate power. The present invention includes a heat management system, which uses the waste heat and/or the excess heat generated by a thermal-processing chamber, to generate a current from a first thermoelectric device. The current from the first thermoelectric device is then delivered to a second thermoelectric device. The second thermoelectric device, driven by the current from the first thermoelectric device, can be used to remove heat from a cooling chamber or else add heat to another processing chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.