Power semiconductor module with insulation shell support for plural separate substrates
US6272015A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 2, 2000 |
| Grant date | Aug 7, 2001 |
| Priority date | — |
| Expiry date | Aug 2, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A power semiconductor device module has a plurality of spaced thermally supported substrates mounted within coplanar openings in an insulation support shall and electrically insulated from one another by the body of the insulation support shell. Each of the substrates may be a separate metal heatsink or a separate IMS sheet. Each of the substrates may receive one or more semiconductor die. A printed circuit board containing control circuits for the die is mounted above the plane of the substrate and contains openings in registry with each substrate for wire bonding the control circuits to the die. The structure permits the reduction in area of any IMS substrate or permits the elimination of the IMS.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.