Method and apparatus for in-situ measurement of workpiece displacement during chemical mechanical polishing
US6273792A · kind A · utility
6Cited by
6References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 11, 1999 |
| Grant date | Aug 14, 2001 |
| Priority date | — |
| Expiry date | Aug 11, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Method and apparatus for in-situ measurement of workpiece displacement during chemical mechanical polishing are disclosed. The chemical mechanical polishing apparatus includes a platen having a polishing material attached thereto and a distance measurement device attached to the platen. The distance measurement device includes a light source and a light sensor. Distance between the device and the workpiece is measured by transmitting light through apertures formed within the platen and the polishing material toward the workpiece and focusing the light reflected from the workpiece on an element within the sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.