Foil for use in filing substrate recesses
US6274245A · kind A · utility
0Cited by
16References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 23, 1999 |
| Grant date | Aug 14, 2001 |
| Priority date | — |
| Expiry date | Jun 23, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2457
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
To fill a hole or trench structure in an article, such as a semiconductor wafer, a layer is formed on the article. The layer extends over the structure so as to seal the mouth thereof. The layer may be deposited by sputtering, etc, or the layer may be deposited as a pre-formed foil. Then, the wafer and layer are subject to elevated pressure and elevated temperature such as to cause material of the layer to flow into the structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.