Method and apparatus for ball placement
US6276598A · kind A · utility
9Cited by
8References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 13, 1999 |
| Grant date | Aug 21, 2001 |
| Priority date | — |
| Expiry date | Jul 13, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3478
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus are described for placing a plurality of balls in a predetermined array. The method and apparatus are particularly suitable for transferring solder balls to a ball grid array package. In the method the balls are transferred from a supply means 1 to a template 2 in which the balls are positioned in the desired array before being picked up by a ball pick head 3 for transfer to the final position while remaining in the desired array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.