Chemical mechanical polishing endpoint process control
US6276987A · kind A · utility
20Cited by
8References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 4, 1998 |
| Grant date | Aug 21, 2001 |
| Priority date | — |
| Expiry date | Aug 4, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/042
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Determination of an endpoint for removing a film from a wafer, by determining a first reference point removal time indicating when a breakthrough of the film has occurred, determining a second reference point removal time indicating when the film has been polished almost to completion, determining an additional removal time indicating an overpolishing interval, and adding the second reference point removal time with the additional removal time to get a total removal time to the endpoint.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.