Patent · US Expired

Method for fabricating solar cells

US6277667A · kind A · utility

5Cited by
3References
34Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 7, 1999
Grant dateAug 21, 2001
Priority date
Expiry dateSep 7, 2019

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02E10/50

Abstract

This invention discloses a novel method for fabricating solar cells. Using the existing screen-printing, masking or photolithography techniques, a P-type or N-type diffusion source is coated on the sites of an N-type or P-type silicon wafer desired for forming electrodes. Then, a low dose P-type or N-type diffusion source is in situ diffused into the N-type or P-type silicon wafer together with the P-type or N-type diffusion source coated on the N-type or P-type silicon wafer in the furnace. Thereafter, a P.sup.- /P.sup.+ or N.sup.- /N.sup.+ diffusion region is formed within the N-type or P-type silicon wafer. Finally, electrodes aligned to the P.sup.+ or N.sup.+ diffusion region are formed by means of screen-printing. Then, a solar cell with high photocurrent and low series resistance can be obtained.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.