Electron beam blanking method and system for electron beam lithographic processing
US6278124A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 3, 1999 |
| Grant date | Aug 21, 2001 |
| Priority date | — |
| Expiry date | Mar 3, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/3175
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electron beam blanking method and system for selectively interrupting the flow of electrons during an electron beam lithographic process minimizes electron beam movement during blanking as the electron beam reaches a target lithographic mask. A first deflection plate pair deflects electrons flowing in the electron beam in the direction of the target lithographic mask. The first deflection plate pair includes a first tapered gap that is formed so that electrons which enter the first tapered gap before the initialization of a blanking voltage experience progressively greater electric field as they pass through the plates for controlling the cumulative deflection as the electrons travel through the first deflection plate pair. A second deflection plate pair further deflects electrons flowing in the electron beam in the direction of the target lithographic mask and includes a second tapered gap for further variably controlling the commutative deflection of the electron beam traveling through the second tapered gap. One or more hybrid integrated circuits provide deflection voltages to the first and second deflection plate pairs for varying the respective degree of electron beam defle…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.