Semi-additive process (SAP) architecture for organic leadless grid array packages
US6278185A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 27, 1998 |
| Grant date | Aug 21, 2001 |
| Priority date | — |
| Expiry date | May 27, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1105
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A substrate which has a first conductive layer that is attached to a first dielectric layer. A second conductive layer is attached to the first dielectric layer. The second conductive layer may be a plated copper material that extends through a via opening of the dielectric and is attached to the first conductive layer. A third conductive layer is attached to the second conductive layer, including a sidewall of the third layer. A second dielectric can be attached to the third conductive layer. The third conductive layer may be a plated nickel-copper composition which improves the adhesion to subsequent layers in the substrate, particularly between the second dielectric and the sidewall of the second conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.