Piezoelectric sensor for measuring bonding parameters
US6279810A · kind A · utility
16Cited by
13References
19Claims
0Family size
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Key dates
| Filing date | Feb 23, 2000 |
| Grant date | Aug 28, 2001 |
| Priority date | — |
| Expiry date | Feb 23, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A sensor for an ultrasonic bonding apparatus comprises a piezoelectric material located between the ultrasonic transducer and an ultrasonic concentrator of the bonding apparatus. The sensor has at least two outputs for measuring different bonding parameters, the outputs being chosen to optimize the signal response for the bonding parameters in question.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.