Tape carrier for BGA and semiconductor device using the same
US6281570A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2000 |
| Grant date | Aug 28, 2001 |
| Priority date | — |
| Expiry date | Jan 26, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L24/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A tape carrier is constituted comprising land 12 for solder ball, formed in a predetermined pattern on insulating film 7 having device hole 10 formed in the middle, leads 9 to be connected to a semiconductor chip, plating power-feeding lead 13 having one end connected to lead 9 and formed on insulating film 7, and easily-broken part 19 provided in the middle of the power-feeding leads. A semiconductor device is constituted wherein tape carrier 2 is provided with plating power-feeding lead 13 formed on insulating film 7, one end of which is drawn out of insulating film 7, the other end being connected to leads 9, and plating power-feeding lead 13 is disconnected from the leads when semiconductor chip 1 is installed. Thus, a tape carrier for BGA which is manufactured easily, capable of achieving higher density of wiring in the wiring pattern, improved in water-resistance and reliability, and a semiconductor device using the same are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.